skcd 14 c 120 i hd ? by semikron rev. 0 ? 18.02.2010 1 cal-diode skcd i f = 20 a v rrm = 1200 v size: 3,74 mm x 3,74 mm skcd 14 c 120 i hd features ? high current density ? e asy paralleling due to a small forward voltage spread ? positive temperature coefficient ? very soft recovery behavior ? s mall switching losses ? high ruggedness ? compatible to thick wire bonding ? compatible to standard solder processes typical applications* ? freewheeling diode for igbt ? particularly suitable for frequencies < 8 khz absolute maximum ratings symbol conditions values unit v rrm t j =25c, i r =0.1ma 1200 v i f(av) t s =80c, t j = 150 c 17 a i fsm 10 ms sin 180 t j =25c 210 a t j = 150 c 170 a t jmax 150 c electrical char acteristics symbol conditions min. typ. max. unit i 2 t t j = 150 c, 10 ms, sin 180 145 a 2 s i r t j =25c, v rrm = 1200 v 0.10 ma t j = 125 c, v rrm =1200v ma v f t j =25c, i f =15a 1.50 1.77 v t j = 125 c, i f =15a 1.50 1.77 v v (to) t j = 125 c 0.92 v r t t j = 125 c 35.2 m ? dynamic characteristics symbol conditions min. typ. max. unit t rr t j = 25 c, 20 a, 600 v, 300 a/s s t rr t j = 125 c, 20 a, 600 v, 300 a/s ns q rr t j = 25 c, 20 a, 600 v, 300 a/s c q rr t j = 125 c, 20 a, 600 v, 300 a/s 4.2 c i rrm t j = 25 c, 20 a, 600 v, 300 a/s a i rrm t j = 125 c, 20 a, 600 v, 300 a/s 14 a thermal characteristics symbol conditions min. typ. max. unit t j -40 150 c t stg -40 150 c t solder 10 min. 250 c t solder 5 min. 320 c r th(j-s) sold. on 0,38 mm dcb, reference point on copper heatsink close to the chip 1.7 k/w mechanical characteristics symbol conditions values unit raster size 3.74 x 3.74 mm 2 area total 13.99 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 720 (5" wafer) pcs
skcd 14 c 120 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix * the specifications of our components may not be considered as an assurance of component characteristics. components have to b e tested for the respective application. adjustments may be necessary. t he use of semikron products in life support appliances and syste ms is subject to prior specification and written approval by semikron . we therefore strongly recommend prior consultation of our pers onal.
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